Datasheet summary
AmberTec UP7530
PDF datasheet mirror for AmberTec UP7530 (DuPont). Verify with OEM before design.
Summary
Product identification
- Product Name: AmberTec™ UP7530 Chelating Resin
- Type: Semiconductor-grade, Uniform Particle Size, Boron-selective Resin
- Functional Group: N-methylglucamine
- Matrix: Macroporous
- Copolymer: Styrene-divinylbenzene
Applications
- Selective boron removal for ultrapure water (UPW) treatment, particularly in the microelectronics industry.
Typical Properties
Physical Properties
- Physical Form: Off-white, opaque, spherical beads
- Shipping Weight: 660 g/L
Chemical Properties
- Ionic Form as Shipped: Free base (FB)
- Total Exchange Capacity: ≥ 0.7 eq/L
- Water Retention Capacity: 51 – 59%
Particle Size
- Particle Diameter: 490 – 590 µm
- Uniformity Coefficient: ≤ 1.1
- Fines (< 300 µm): ≤ 1%
- Oversize (> 850 µm): ≤ 3%
Ultrapure Water Performance
- Resistivity (24 h rinse): ≥ 15 MΩ⋅cm
- ΔTOC (24 h rinse): ≤ 5 ppb
Suggested Operating Conditions
- Recommended Operating Temperature: 15 – 25°C (59 – 77°F)
- Recommended Service Flowrate: 40 – 60 BV*/h
- *1 BV (Bed Volume) = 1 m³ solution per m³ resin or 7.5 gal per ft³ resin
Hydraulic Characteristics
Pressure drop data as a function of service flowrate is shown in Figure 1 of the original document. These expectations are valid for clean beds; accumulated solids will increase pressure drop.
- Temperature Range for Pressure Drop Data: 10 – 60°C (50 – 140°F)
UPW Rinse Properties
AmberTec™ UP Ion Exchange Resins are processed to ensure high purity water quality for semiconductor applications. A typical rinse-down curve for TOC is shown in Figure 2 of the original document.
Disclaimer: This extraction may miss figures, footnotes, or revisions. Contractual data must match the OEM PDF revision used on the project.
Official datasheet (PDF)
Curated from selected public technical reference material for discovery and preliminary comparison. This summary is not a substitute for a current certified manufacturer datasheet. Verify revisions and design limits before use.